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Shielded SMD Power Inductors LanTu Micro SDRI127-220MT with Accurate Dimensions and Low DC Resistance

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Shielded SMD Power Inductors LanTu Micro SDRI127-220MT with Accurate Dimensions and Low DC Resistance

Current - Saturation (Isat) : 7A

Description : 7A SMD,12.5x12.5mm Fixed Inductors RoHS

Mfr. Part # : SDRI127-220MT

Model Number : SDRI127-220MT

Package : SMD,12.5x12.5mm

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Shielded SMD Power Inductors - SDRI127 Series

Product Overview

The SDRI127 Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high-performance power applications. These inductors feature a closed magnetic circuit design to minimize leakage flux, high saturation current capability, and low DC resistance. Their highly accurate dimensions ensure compatibility with automatic mounting processes. Available in various package sizes and a wide inductance range, they are suitable for a variety of electronic devices including VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.

Product Attributes

Brand: LANTU
Manufacturer: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
Series: SDRI127
Type: Shielded SMD Power Inductors
Certifications: RoHS, Halogen Free, REACH Compliance
Origin: Shenzhen, China (implied by manufacturer location)

Technical Specifications

General Specifications:

Attribute	Value
Operating Temperature	-40 to +125 (Including coil self-temperature rise)
External Dimensions (LWH)	12.5 12.5 8.0 mm
Inductance Tolerance	J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
Test Equipment (Inductance)	HP4284A, HP4285A or equivalent LCR meter
Test Equipment (Current)	HP4284+42841A or equivalent
Test Equipment (Q Factor)	HP4285A or equivalent
Test Equipment (DCR)	Chroma 16502 or equivalent
Saturation Current Definition	DC current at which inductance drops 30% from its value without current.
Temperature Rise Current Definition	The actual value of DC current when the temperature rise is T 40 (Ta=25).
Rated DC Current	The lesser of Isat or Irms.
Recommended Land Pattern	(Refer to diagram in source document)
Recommended Reflow Soldering Curve	(Refer to diagram in source document)
Storage Conditions	Temperature: 5~40C, Humidity: 35~65% RH or less (within 12 months)

Electrical Characteristics:

Part No.	Inductance (H)	Tolerance	Test Freq (L @0A)	Q Factor Min	Test Freq (Q)	DCR () Max	Saturation Current (A) Max	Temperature Rise Current (A) Max
SDRI127-1R0N	1.0	30%	100KHz	20	1MHz	0.009	26.00	10.00
SDRI127-2R2N	2.2	30%	100KHz	20	1MHz	0.012	21.00	8.00
SDRI127-2R7N	2.7	30%	100KHz	20	1MHz	0.013	19.00	8.00
SDRI127-3R3N	3.3	30%	100KHz	20	1MHz	0.013	16.00	8.00
SDRI127-3R9N	3.9	30%	100KHz	20	1MHz	0.013	14.00	7.50
SDRI1274R7N	4.7	30%	100KHz	30	1MHz	0.016	12.00	6.80
SDRI127-6R1N	6.1	30%	100KHz	30	1MHz	0.018	11.50	6.60
SDRI127-6R8N	6.8	30%	100KHz	30	1MHz	0.019	10.50	6.60
SDRI127-7R6N	7.6	30%	100KHz	30	1MHz	0.020	10.00	5.90
SDRI127-8R2N	8.2	30%	100KHz	30	1MHz	0.020	9.50	5.60
SDRI127-100N	10	30%	100KHz	35	1MHz	0.021	9.00	5.40
SDRI127-120M	12	20%	100KHz	35	1MHz	0.240	8.50	4.90
SDRI127-150M	15	20%	100KHz	35	1MHz	0.027	8.00	4.50
SDRI127-180M	18	20%	100KHz	35	1MHz	0.039	7.50	3.90
SDRI127-220M	22	20%	100KHz	35	1MHz	0.043	7.00	3.60
SDRI127-270M	27	20%	100KHz	35	1MHz	0.046	6.50	3.40
SDRI127-330M	33	20%	100KHz	35	1MHz	0.065	5.50	3.00
SDRI127-390M	39	20%	100KHz	35	1MHz	0.072	5.00	2.75
SDRI127-470M	47	20%	100KHz	35	1MHz	0.100	4.60	2.50
SDRI127-560M	56	20%	100KHz	35	1MHz	0.110	4.40	2.35
SDRI127-680M	68	20%	100KHz	35	1MHz	0.140	4.00	2.10
SDRI127-820M	82	20%	100KHz	35	1MHz	0.160	3.80	1.95
SDRI127-101M	100	20%	100KHz	40	0.796MHz	0.220	3.50	1.70
SDRI127-121M	120	20%	100KHz	40	0.796MHz	0.250	3.00	1.60
SDRI127-151M	150	20%	100KHz	40	0.796MHz	0.280	2.70	1.42
SDRI127-181M	180	20%	100KHz	40	0.796MHz	0.350	2.50	1.30
SDRI127-221M	220	20%	100KHz	40	0.796MHz	0.390	2.00	1.16
SDRI127-271M	270	20%	100KHz	40	0.796MHz	0.560	1.95	1.06
SDRI127-331M	330	20%	100KHz	40	0.796MHz	0.640	1.90	0.95
SDRI127-391M	390	20%	100KHz	40	0.796MHz	0.700	1.65	0.88
SDRI127-471M	470	20%	100KHz	40	0.796MHz	0.980	1.50	0.79
SDRI127-561M	560	20%	100KHz	40	0.796MHz	1.070	1.40	0.73
SDRI127-681M	680	20%	100KHz	40	0.796MHz	1.460	1.30	0.67
SDRI127-821M	820	20%	100KHz	40	0.796MHz	1.640	1.10	0.60
SDRI127-102M	1000	20%	100KHz	40	0.796MHz	1.820	1.00	0.55

Product Identification Example: SDRI 127 470 M T

SDRI: Series Type
127: Dimensions (12.512.58.0 mm)
470: Inductance (47 H)
M: Inductance Tolerance (20%)
T: Packing (Tape & Reel)

Packaging Specifications:

Part No.	Tape Dimension W (mm)	Tape Dimension P (mm)	Tape Dimension H (mm)	Reel Dimensions A (mm)	Reel Dimensions B (mm)	Reel Dimensions C (mm)	Reel Dimensions D (mm)	Reel (PCS)	Inside Box (PCS)	Outside Carton (PCS)
SDRI127	24	16	11.5	24.4	100	13	330	500	1000	4000

Cover Tape Peel Off Condition:

Cover tape peel force: 10 to 120g
Noodle strip peeling angle: 165 to 180

Reliability Testing:

Item	Requirements	Test Methods and Remarks
Terminal Strength (SMT)	Meet requirements without loose terminal.	Pulling test based on terminal area; Solder paste thickness: 0.12mm.
Terminal Strength (DIP)	Meet requirements without loose terminal.	Applied force based on terminal diameter (5N to 40N for 10 sec).
Resistance to Flexure	No visible mechanical damage.	Flexure 2mm, Speed 0.5mm/sec, Keep time 30 sec.
Dropping	No case deformation, no short/open.	Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice each.
Solderability	Wetting >75% coverage, Terminals >95% solder coverage.	Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin/75% ethanol.
Vibration	No visible mechanical damage; Inductance change: 10%; Q factor change: 20%.	Simple harmonic motion, 10-55 Hz, 1.5mm amplitude, 2 hours in 3 directions.
Thermal Shock	No visible mechanical damage; Inductance change: 10%; Q factor change: 20%.	100 cycles of temperature shock (-55~40 to 85~125), Max 20 sec transforming interval.
Low Temperature Storage	No visible mechanical damage; Inductance change: 10%; Q factor change: 20%.	Temperature: -55~-402, Duration: 962 hours.
High Temperature Storage	No visible mechanical damage; Inductance change: 10%; Q factor change: 20%.	Temperature: 85~1252, Duration: 962 hours.
Damp Heat (Steady States)	No visible mechanical damage; Inductance change: 10%; Q factor change: 20%.	Temperature: 602, Humidity: 90%-95% RH, Duration: 962 hours.
Heat endurance of Reflow soldering	No significant defects; L/L 10%; Q/Q 30%; DCR/DCR 10%.	Twice reflow, Peak temperature: 260+0/-5.
Resistance to solvent test	No case deformation, change in appearance, or obliteration of marking.	Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times.
Overload test	No smoke, smell, or fire during test; characteristics normal after test.	Apply twice rated current for 5 minutes.
Voltage resistance test	No breakdown during test; characteristics normal after test.	DC1000V, Current: 1mA, Time: 1Min (for parts with two coils).

Usage Precautions

Store within 12 months under conditions: 5~40C, 35~65% RH. Soldering of terminal electrodes may deteriorate beyond this period.
Avoid use and storage in corrosive environments (salt, acid, alkali).
Avoid direct contact with terminals by bare hands due to oil secretions affecting solderability.
Handle carefully to prevent damage from dropping or improper removal.
Do not bend terminals excessively to avoid wire fracture.
Do not clean coils; contact the manufacturer if cleaning is necessary.
Keep away from magnets or magnetic objects.
Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
Soldering corrections after mounting should be within specified conditions to prevent short circuits, performance degradation, or lifespan reduction.
Allow for sufficient thermal design margin due to self-heating when power is on.
For non-magnetic shielded types, careful coil layout is required on the PCB to prevent malfunctions due to magnetic interference.

2410121647_LanTu-Micro-SDRI127-220MT_C5127260.pdf

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