The SDRH104R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DCR. Featuring a closed magnetic circuit design to minimize leakage, these inductors offer high-precision dimensions suitable for automatic mounting. They are available in various package sizes and inductance ranges, complying with RoHS, Halogen Free, and REACH standards. Ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
| Item | Requirements | Test Methods and Remarks |
| Terminal Strength (SMT) | Meet specified force and duration requirements without loose terminals. | Pulling test based on terminal cross-sectional area; Solder paste thickness: 0.12mm. |
| Terminal Strength (DIP) | Meet specified force and duration requirements without loose terminals. | Pulling test based on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | Flexure: 2mm; Speed: 0.5mm/sec; Duration: 30 sec. |
| Dropping | No case deformation or change in appearance; No short and no open. | Drop from 1m height in specified angles and surfaces, twice in each direction. |
| Solderability | Wetting shall exceed 75% coverage; Terminals must have 95% minimum solder coverage. | Solder temperature: 2402; Duration: 3 sec; Solder: Sn/3.0Ag/0.5Cu; Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Simple harmonic motion, 10-55 Hz, 2 hours in 3 mutually perpendicular directions. |
| Thermal Shock | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | 100 cycles of temperature change between (85~125) and (-55~40). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Temperature: -402; Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Temperature: 852; Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage; Inductance change: Within 10%; Q factor change: Within 20%. | Temperature: 602; Humidity: 90% to 95% RH; Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance; L/L10%; Q/Q30%; DCR/DCR10%. | Reflow soldering twice, peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire; The characteristic is normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown; The characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
The recommended reflow conditions are set according to our soldering equipment. Users should adjust and confirm according to their specific environment and equipment.
